Advantiv maintains an extensive inventory of silicon wafers.

Products ranging from filmed to patterned test wafers can be quickly put into processing. Primarily supported by our Japan-based parent company Advantec Co., Ltd., we supply into all divisions of the semiconductor industry. Our diameter expertise includes 50mm through 450mm substrates.

Test Wafers

Bare Wafers

Premium silicon wafers

  • 50mm to 450mm
  • 300mm 17nm low particle (high grade) – Mechanical Grade (low grade)
  • 300mm low particle T-Ox/SiN/Resist
  • 300mm low particle reclaimed wafers (26nm to 200nm capability)
  • 300mm low and high haze measurement wafers
  • 300mm Ultra flat/Bowed wafers/Low metals
  • 300mm 0-degree notch wafers
  • 200mm and 300mm Non standard thick(up to 1000um) wafers
  • 200mm and 300mm Polishing service for SiC/GaN/Sapphire
Bare Wafer-AdvantecWafers

Blanket Wafers

  • Deposition methods: Thermal, PVD, LPCVD, PECVD and ALD
  • Films
    – Thermal oxide, High Density Plasma oxide, TEOS, USG, PSG,
    BPSG, polysilicon
    [Metals / Evaporated Metals]
    a-C, Ag, Al, Au, Co, Cu, Fe, Mn, Mo, Ni, Ru, Ta, TaN, Ti, TiN, W
    [Low k Films]
    Black Diamond (k ~ 3, 2.7 and 2.55)
    [Photoresist Blankets]
    [ArF, KrF, i-Line, DUV, etc.]
    [Silicon Films]

    (a-Si, SiC, SiCN, SiGe, SiN, SiON)
Blanket Wafer

Patterned Wafers

  • [MIT854]
    CMP characterization pattern commonly used with copper
  • [MIT864]
    CMP characterization pattern used for STI polish
  • [R00H]
    Simple trench pattern commonly used for deposition applications
  • [40nm L/S ]
    Small features down to 40nm L/S for various etch/ALD/other applications
  • [Custom]
    *Customer provided design files e.g. GDS, STP,etc.

Alternative Substrates
SiC, glass, quartz, solid-core substrates (e.g. Al, W, Cu), gallium nitride to gallium arsenide.